Solder Dispensing

Precision dispensing of solder dots, lines, and even complex patterns can be achieved on the 3Dn Series platform. Many solder alloys and types can be dispensed using the SmartPump™ micro-dispensing head. The SmartPump™ is optimized through software for a specific solder paste. Once the SmartPump™ has been optimized, no additional tuning is necessary, and the results have been shown to be highly repeatable through pumping cycles. Solder dots as small as 50 microns have been achieved.

Similar to adhesive dispensing, nScrypt's solder dispensing tools produce precise and accurate solder lines and dots on diverse substrates and electronic devices, this as well is a core process for the 3Dn Series and Smartpump™.